Reference to custom
Translate dev kit wiring into a DFM carrier with controlled BOM alternates.
Hardware Form / Edge AI / Jetson carrier
Edge AI · PCBA + thermal
Jetson carrier manufacturing
Dev kits prove software. Your SKU needs a carrier that fits the enclosure, passes EMC, and survives reflow twice without warping.
Jetson carrier manufacturing covers schematic and layout for module sockets, power trees, MIPI and GMSL camera routes, thermal interface design, and SMT through assembly test. Hardware Form runs engineering and production so thermal and supply choices stay valid at volume.
Carrier decisions that stick
| Topic | Early choice | Production risk if ignored |
|---|---|---|
| Power | Orin NX vs AGX budget | Brownouts when Wi-Fi and GPU peak together |
| Cameras | Direct MIPI vs deserializer | Length limits and skew on the factory floor |
| Thermal | Spreader vs heat pipe to chassis | Throttling that looks like a model regression |
| Test | Bed-of-nails vs flying probe | Yield surprises on first production lot |
Related: edge AI programs, SMT + PCBA, bring-up firmware.
Thermal co-design
Spreaders matched to enclosure airflow and orientation in the field.
Camera integration
FPC lengths, ESD, and calibration fixtures for lens modules.
Production test
GPU stress, storage burn-in, and vision loopback at end of line.
Jetson carrier FAQ
Which Jetson modules do you support?
Orin Nano, Orin NX, and AGX Orin class designs on custom carriers; share your module SKU and thermal envelope.
Can you manufacture the module itself?
We manufacture carriers, assemblies, and finished devices. Compute modules come from NVIDIA authorized supply.
Do you handle FCC/CE for the full device?
Yes as part of whole-product programs with certification planning.